Light
For use in metallurgical and chemical industries as alloying additives, catalysts, production of reagents.
Particle structure
| Grid size per ISO 565, μm | Particle size, μm | Particle size distribution, % | ||
|---|---|---|---|---|
| CPL-1 | CPL-2 | CPL-3 | ||
| 63 | ≥63 | 5,0 max | 5,0 max | 10,0 max |
| <63 | 95,0 min | 95,0 min | 90,0 min | |
| Bulk density, g/cm3 | 0,65-0,85 | 0,90-1,10 | 1,25-1,45 | |
| Copper mass fraction, %, min | 99,5 | 99,6 | ||
| Oxygen mass fraction, %, max | 0,40 | 0,30 | 0,25 | |
Note: “<” represents undersize material, “≥” represents oversize material in the particle size value
Fine
For use in the electronics industry (thick and thin filming, mixing with silver to make pastes), die casting, production of conductive fillers, diamond tools, catalysts, and vacuum switches.
Particle structure
| Grid size per ISO 565, μm | Particle size, μm | Particle size distribution, % | |||
|---|---|---|---|---|---|
| CPF-1 | CPF-2 | CPF-3 | CPF-4 | ||
| 45 | <45 | 95,0 min | – | ||
| 25 | <25 | – | 90,0 min | ||
| Mass fraction of oxygen, %, max | 0,45 | ||||
| Bulk density, g/cm3 | 1,60-2,00 | 1,25-1,60 | 1,10-1,60 | 1,60-2,00 | |
| Copper mass fraction, %, min | 99,5 | ||||
| Oxygen mass fraction, %, max | 0,20 | 0,30 | |||
Note: “<” represents undersize material, “≥” represents oversize material in the particle size value
Medium
For the production of sintered products in metallurgical, electrical, aeronautical, automotive, machine-building industries (brushes for electric machines, rings, bushings, bearings, electrical contacts, welding electrodes, brake pads, clutch linings, diamond tools, consumer goods for household and economic purposes).
Particle structure
| Grid size per ISO 565, μm | Particle size, μm | Particle size distribution, % | ||||
|---|---|---|---|---|---|---|
| CPS-1 | CPS-12 | CPS-14 | CPS-A | CPS-11 | ||
| 100 | ≥100 | 0,5 max | 0,5 max | 0,1 max | ||
| 71 | <71 | 90,0 min | 90,0 min | – | ||
| 63 | ≥63 | – | – | – | ||
| <63 | – | – | 95,0 min | |||
| 45 | <45 | 65,0-80,0 | 73,0-80,0 | – | ||
| Bulk density, g/cm3 | 1,25-2,00 | 1,20-1,60 | 1,50-2,00 | 1,30-1,50 | 1,25-1,90 | |
| Copper mass fraction, %, min | 99,5 | |||||
| Oxygen mass fraction, %, max | 0,20 | 0,30 | 0,20 | |||
Note: “<” represents undersize material, “≥” represents oversize material in the particle size value
Ultrafine
For the production of electronic circuits, thick film pastes, electrically and thermally conductive pastes, electrodes, pyrotechnics, printing (screen-printing), conductive inks for RFID tags and portable electronics, anticorrosive, electromagnetic shielding and decorative coatings.
Particle structure
| Parameters | Values | |
|---|---|---|
| CPU-5 | CPU-10 | |
| D50, мкм | 5,0±0,75 | 10,0±1,0 |
| D99, мкм | <30 | <100 |
| Bulk density, g/cm3 | 0,6-1,6 | |
| Specific surface area, cm2/g, min | 2500 | |
| Copper mass fraction, %, min | 99,3 | |
| Oxygen mass fraction, %, max | 0,45 | |
Note: “<” represents undersize material, “≥” represents oversize material in the particle size value
